SiSiC (RBSC) cantilever paddles are key components in semiconductor wafer loading systems.
SiSiC Cantilever Paddles deliver stable performance and do not deform at high temperatures. They provide a high wafer-loading capacity and are suitable for robotic, automated loading and handling systems.
Due to the stable cross-section and excellent deformation resistance of Cantilever Paddles, it becomes possible to process larger-diameter wafers using existing furnace tubes.
The thermal expansion coefficient of Cantilever Paddles is close to that of LPCVD coatings, making them highly suitable for LPCVD processes. This significantly extends the maintenance and cleaning cycle and greatly reduces contamination.
Product Description
ITEM | 单位 | 反应烧结碳化硅 RBSiC(SiSiC) | 常压烧结化硅 SSiC |
| UNIT | DATA | DATA | |
最高使用温度 Max Temperature of Application | ℃ | 1380 | 1600 |
密度 Density | g/cm³ | >3.02 | >3.1 |
气孔率 Open Porosity | % | <0.1 | <0.1 |
抗弯强度 Bending Strength | Mpa | 250(20℃) | >400 |
| MPa | 280(1200℃) | ||
弹性模量 Modulus of Elasticity | Gpa | 330(20℃) | 420 |
| GPa | 300(1200℃) | ||
传导系数 Thermal Conductivity | W/m.k | 45(1200℃) | 74 |
热膨胀系数 Coefficient of Thermal Expansion | K¹×10⁶ | 4.5 | 4.1 |
维氏硬度 Vickers Hardness HV₁ | Gpa | 20 | 22 |
耐酸碱性 Acid-alkaline-proof | Excellent | Excellent |
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